Single Wafer Etching System

JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system is configured to your process parameters with oscillating spray nozzles, adjustable wafer speed (RPM), and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoirs provides repeatable volume and mixing control. Standard Features Adjustable Oscillating Spray Nozzles & Pressures Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm. Multi Substrate Size Capability