Process	Purpose	Step 1	Step 2	Step 3	Step 4	Step 5	Step 6	Step 7	Step 8	Step 9
Pre Diffusion Clean	Removal of light organics,silicon dioxide layer, particles, metals; protective oxide regrowth	Sulfuric Quartz Bath	QDR	HF (50:1)	QDR	SC1	DI H2O Rinse	SC2 Quartz Bath	DI H2O Rinse	Dry
Nitride Etch	Etch Silicon Nitride Layer	HF (50:1)	QDR	Phosphoric Nitride etch-special	Phosphoric Nitride etch-special	QDR	SC1	QDR	Dry
Pre Gate Clean	Removal of light organics, silicon dioxide layer, and metals.	Sulfuric Quartz Bath	QDR	HF (50:1)	DI H2O Rinse	SC2 Quartz Bath	DI H2O Rinse	Dry
Pre-metal Clean	Removal of light organics, particles, and silicon dioxide layer.	Sulfuric Quartz Bath	QDR	SC1	DI H2O Rinse	HF (50:1)	DI H2O Rinse	Dry
Oxide Etch	Silicon etch, Polysilicon etch, Silicon Dioxide removal	HF	DI H2O Rinse	BOE	DI H2O Rinse	Dry
Photoresist Strip, Post Ash Clean, Post Implant Resist Strip, Post Etch Resist Strip	Positive Photoresist removal without etching silicon, dilicon dioxide, silicon nitride or SOI for nonmetal applications	Sulfuric Quartz Bath	QDR	Sulfuric Quartz Bath	QDR	Dry
Metal Liftoff	Negative removal of photoresist, metal	NMP(Down Flow) Stainless Steel	NMP(Ultrasonic) Stainless Steel	Acetone	IPA	Dry
KOH Etch	Bulk Silicon Etch	Sulfuric Quartz Bath	QDR	KOH	QDR	Dry