Whether your metal lift off process demands a fully automated process or simply a manual configuration, JST's Lift Off Stations offer dry to dry, cost effective solutions for the removal of residual metals.The wafer cassette is loaded onto the agitation arm and submersed into a heated solvent bath. The unit is programmed for mechanical agitation. During this agitation cycle, the stripping solvent is recirculated through the reservoir where it is filtered and returned to the agitation bath. This continual filtration prevents redeposition of the metals onto the wafers. A removeable filter is located in the solvent reservoir to capture the heavy lift off metals for easy reclaim. Once the cycle is completed, the stripping solvent is drained back to the reservoir where it is again filtered through a submicron filter and kept heated to temperature for use in the next cycle.

The wafers are then sprayed with a second solvent to make sure all metal stringers that bridge the edge of the photoresist profile to the device are removed. Once this cycle is complete, the wafers are thoroughly rinsed in a clean solvent (IPA or acetone) and then dried in JST’s patented CLV Dryer, eliminating the need for a DI water rinse. JST's patented CLV Dryer uses pure, IPA vapor to cleanse the wafers and displace any residual rinse liquid. The dryer then pulls a vacuum to remove the vapors and the tank is backfilled with argon or nitrogen to provide a safe operator environment for wafer removal. A final DI water rinse is available if needed prior to spin drying.